Upstream
Checked TSMC's and Samsung's manufacturing roles, SK hynix's and Micron's memory generations, and contract manufacturing by Hon Hai, Wistron and Fabrinet. System assembly is distinguished from wafer processes.
Not yet covered: Supply shares for each HBM generation and specific factories and packaging allocations for each GPU generation remain incomplete. Unnamed direct customers in the annual report cannot be identified.
FY2026 Annual Report: Manufacturing and Competition ↗U.S. chip and AI-system manufacturing footprint ↗Micron discloses volume production of HBM4 for Vera Rubin ↗Multi-year memory technology collaboration with SK hynix ↗